Plasma Treatment System
용도
Plasma Etching
Plasma Treatment System
Plasma Treatment System
기본사양
RF Power : 300W
Substrate Size : up to 250 mm
Gas : O2, Ar, N2, H2, CF4
Substrate size : up to 200 mm
Substrate Size : up to 250 mm
Gas : O2, Ar, N2, H2, CF4
Substrate size : up to 200 mm
응용분야
Plasma treatment of substrate such as glass, ITO glass, plastic substrate (PET, PEN etc)
Surface treatment of organic / inorganic layer for hydrophilic or hydrophobic proerties
Surface treatment of organic / inorganic layer for hydrophilic or hydrophobic proerties